產(chǎn)品展示
產(chǎn)品分類
適用領(lǐng)域： ?Bonding Relevant Industries: Bonding 適用材料: ?SiC Suitable for Processing: SiC (Silicon Carbide) 晶圓尺寸: ?12/8/6英寸 Wafer Size: 12/8/6 inch
適用領(lǐng)域：單晶生長 Relevant Industries: ?Single Crystal Growth 適用材料: ?SiC、AIN Suitable for Processing: ?SiC (Silicon Carbide), AlN (Aluminum Nitride) 晶圓尺寸: ?12/8/6/4英寸,8英寸多坩堝 Wafer Size: 12/8/6/4 inch, 8 inch Multi-crucibles Provide6/8 inches process
適用領(lǐng)域：單晶生長 Relevant Industries: ?Single Crystal Growth 適用材料: ?Si、AIN Suitable for Processing: ?SiC (Silicon Carbide), AlN (Aluminum Nitride) 晶圓尺寸: ?12/8/6/4英寸,8英寸多坩堝 Wafer Size: 12/8/6/4 inch, 8 inch Multi-crucibles
適用領(lǐng)域：單晶生長、EFG、LPE Application Fields: Single Crystal Growth, Edge-defined Film-fed Growth (EFG), Liquid Phase Epitaxy (LPE) 適用材料: ?SiC、Ga2O3、YAG、LYSO、LT/LN、GGG、YAP等晶體 Suitable for Processing: SiC (Silicon Carbide), Ga2O3 (Gallium Oxide), YAG (Yttrium Aluminum Garnet), LYSO (Lutetium Yttrium Orthosilicate), LT/LN (Lithium Tantalate / Lithium Niobate), GGG (Gadolinium Gallium Garnet), YAP (Yttrium Aluminum Perovskite) and other crystals 晶圓尺寸: ?12/8/6/4英寸 Wafer Size: 12/8/6/4 inch
適用領(lǐng)域： ?單晶生長、多晶熱沉 Relevant Industries: Single Crystal Growth, Polycrystalline Heat Sink Fabrication 適用材料: ?Diamond Suitable for Processing: Diamond 晶圓尺寸: ?8/6/4/3/2英寸 Wafer Size: 8/6/4/3/2 inch